LED encapsulation is a process to implant LED chip into a sealed package body. The procedure is to pour liquid epoxy into the LED molding chamber first, and then insert the LED bracket that has undergone the press welding, then put the mold into the oven, and the LED gets shaped when the epoxy solidifies. The main purposes of encapsulating LEDs are to protect LED chip and complete the electrical interconnection.
LED Encapsulation Procedure
1.Solid crystal: also known as Die Bond. It is a process by bonding the wafer to a specified area of the holder through a colloid (typically silver glue or insulating glue for the LED) to form a thermal path or an electrical path providing conditions for subsequent wire bonding.
2.Wire bonding: wire bonding refers to the process connecting the chip electrode and stent electrodes with metal wire to form a conductive loop.
3.Sealants: sealants is a process that putting the well allocated fluorescent glue into the stent cup, to guarantee the generation of white light and to build the physical protection for the chip.
4.Baking: bake according to the material requirements to make the colloid fully cured. increasing the bonding strength between the bracket, meanwhile aging of the LED.
5.Testing: check the appearance and test the photoelectric parameters of LED lamp beads. Sort the finished products according to the requirements.
6.Package and storage: package the products with anti-static packaging, and store them in the prescribed environmental conditions.